news.ucsb.edu

Next-gen 3D transistors transform energy-efficient electronics

In a significant advancement for semiconductor technology, researchers at UC Santa Barbara have unveiled novel three-dimensional (3D) transistors utilizing two-dimensional (2D) semiconductors. Their ...
Pratt Institute

3D Printing Architecture / Next-Gen Urban-Tech / Automated Robotic Construction

Gantry-crane meets robot form-factor to create flexible and collaborative production methods for additive construction to meet the growing demand for housing. The research effort explores automated 3D ...
Singularity Hub

3D Printing Promises to Transform Architecture—and Create Forms That Blow Today’s Buildings Out of the Water

In architecture, new materials rarely emerge. For centuries, wood, masonry, and concrete formed the basis for most structures on Earth. In the 1880s, adoption of the steel frame changed architecture ...
Semiconductor Engineering

3D Stacked Device Architecture Enabled By BEOL-Compatible Transistors (Stanford et al.)

A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...
Semiconductor Engineering

Baby Steps Toward 3D DRAM

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But ...