Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The integrated MCHEdesign platform is available at the Kaltra website. Existing MCHEdesign users will receive automatic access to the updated version. New users can register via the inquiry form.

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

Accelsius, a two-phase liquid cooling company, is deploying one of its thermal rack simulation systems at a data center in Ohio. “We're excited to announce another deployment! This time, our Thermal ...

Vishay Intertechnology, Inc. introduced a new version of its free ThermaSim online thermal simulation tool for power MOSFETs, microBUCK® power ICs, and DrMOS products: ThermaSim 3.0. For precise ...

With concerns over air pollution and petroleum supplies, the use of hybrid electric vehicles (HEVs) and electric vehicles (EVs) have come to the forefront as alternatives to conventional gasoline and ...