Chipmakers worldwide consider Automatic Test Pattern Generation (ATPG) their go-to method for achieving high test coverage in production. ATPG generates test patterns designed to detect faults in the ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Many chipmakers face a difficult trade-off — improve quality without affecting yield. Traditional testing methods fail to navigate this challenge due to their limited visibility below the pass/fail ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...