We return to [Tom Verbeure] hacking on Symmetricom GPS receivers. This time, the problem’s more complicated, but the solution remains the same – hardware hacking. If you recall, the previous frontier ...
A basic comparison between CoWoS, wafer-scale integration, and CoWoP establishes distinctions among package substrate, ...
Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, ...
Abstract—The market for Semiconductor Intellectual Property is well served for standard process technologies but not all functions are offered in all processes. Mixing and matching high performance ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
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