IEEE

A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
IEEE

On-Chip Memory Optimization for Deep Learning Inference on Resource-Deficient Devices

Abstract: Advances in deep learning (DL) have enabled the integration of intelligence into low-end Internet-of-Things (IoT) devices. However, traditional DL inference on resource-constrained ...
NPR

Memory loss: As AI gobbles up chips, prices for devices may rise

The world has a memory problem, thanks to artificial intelligence. The explosion in AI-related cloud computing and data centers has led to so much demand for certain types of memory chips that now ...
Digi Times

Memory shortages reshape smartphone market as costs hit 35% of mid-range devices

Research institutions predict that global smartphone shipments could decline by 1–2% in 2026 due to memory shortages, with mid- and low-range devices expected to be most affected. Based on the Bill of ...
Bleeping Computer

Microsoft to block Exchange Online access for outdated mobile devices

Microsoft announced on Monday that it will soon block mobile devices running outdated email software from accessing Exchange Online services until they're updated. As the Exchange Team explained, ...