A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
Abstract: We numerically and experimentally investigate the statistical characteristics of power coupling in coupled multi-core fibres with random twisting. We also simulate the external twisted ...
Abstract: This letter analyzes the proposed variable-sawtooth-based PWM controller for the ac-coupled envelope tracking (ET) supply modulator (SM). The ET SM includes a linear amplifier and a ...
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