Aehr Test Systems: Aehr Announces Over $5.5 Million in Sonoma Ultra-High-Power System Orders to Test and Burn-in AI Processors; Introduces New Fully-Automated Sonoma for Next ...

FREMONT, CA / ACCESS Newswire / January 8, 2026 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced that during its fiscal third quarte ...
Le Lézard

Aehr Announces Over $5.5 Million in Sonoma Ultra-High-Power System Orders to Test and Burn-in AI Processors; Introduces New Fully-Automated Sonoma for Next-Generation AI ...

FREMONT, CA / ACCESS Newswire / January 8, 2026 / Aehr Test Systems , a worldwide supplier of semiconductor test and burn-in solutions, today announced that during its fiscal third quarter to date it ...
Le Lézard

Aehr Test Systems Reports Fiscal 2026 Second Quarter Financial Results and Reinstates Guidance Driven by Improved Visibility for AI Processor and Data Center Semiconductor Test ...

FREMONT, CA / ACCESS Newswire / January 8, 2026 / Aehr Test Systems , a worldwide supplier of semiconductor test and burn-in solutions, today announced financial results for its second quarter of ...

Aehr Test Systems to Present at the 28th Annual Needham Growth Conference on January 13

FREMONT, CA / ACCESS Newswire / January 6, 2026 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced that President and CEO Gayn Erickso ...

Aehr Test Systems to Announce Second Quarter Fiscal 2026 Financial Results on January 8, 2026

FREMONT, CA / ACCESS Newswire / December 30, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced that it will report financial ...
IEEE

A Multiscale Attention Mechanism Super-Resolution Confocal Microscopy for Wafer Defect Detection

Abstract: Confocal microscopy is an essential component of wafer defect detection systems. Wafers are raw materials used in the manufacture of semiconductor chips. The semiconductor chip manufacturing ...
IEEE

Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...