Oct 8 (Reuters) - TopBuild Corp (BLD.N), opens new tab said on Wednesday it has acquired Specialty Products and Insulation (SPI) for $1 billion in cash, about a year after the two building materials ...

Have computer programmers innovated themselves out of a job? That’s the fear driving theories that AI will remove the need for humans who can write computer code. Today's most sophisticated large ...

Pole Przemyslaw "Psyho" Debiak won the prestigious AWTF Heuristic programming tournament. He beat not only the human participants, but also AI. He is the only human to have succeeded. A Polish ...

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, ...

HSINCHU, July 15, 2025 -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for ...

Hsinchu, Taiwan – July 15, 2025 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express™ (UCIe™) ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

Dublin, March 18, 2025 (GLOBE NEWSWIRE) -- The "SPI Flash Market by Technologies (3D NAND, EEPROM, NAND), Interface (Concurrent, Parallel, Serial (SPI)), Programming Methods, End-User Industries, ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...