Abstract: In this article, a 12-switch non-isolated LLC (NI-LLC) converter is proposed to address the application requirements of 4:1 bidirectional fixed-ratio voltage conversion in 48 V mild hybrid ...
Abstract: This study introduces a breakthrough achievement of 0.1-Gb/mm2 wing-shaped high-density embedded 3-D via resistive random access memory (Via RRAM) in TSMC’s 16-nm FinFET CMOS logic process.
The TS1 Series has been developed to address rising demand for connectors capable of handling sustained high-voltage and high-current loads while operating reliably in harsh environments.
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