Investigating Competing Failure Modes in Microelectronic Devices Due to Small Temperature Variations
Abstract: Electronic packages with solder interconnects, such as Chip Scale Packages (CSP) and Ball Grid Arrays (BGA), are extensively utilized in various applications, including cell phones, ...
Abstract: With the development of the semiconductor industry, more advanced electronic packaging solutions are being developed for improved manufacturing processes. The sparse Ball Grid Array (BGA) ...
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