Abstract: Metal foams appear as innovative solutions for cooling high-density power electronic systems. In these assemblies, the foam is currently soldered on a copper substrate. However, the ...
HOWTO Fix Multiple Definitions Linker Error How It Works HOWTO Basic configurations ...
Life Prediction of Solder Interconnects under Harsh Thermal Cycling from Microstructural Degradation
Abstract: Designing dependable solar PV systems that last a long time and function in a wide variety of temperatures in low earth orbit requires precise forecast of solder interconnect lifespans, yet ...
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