Abstract: Molding process of packages is the key link in IC packages and test. Epoxy resin is melted to fill into a specific mold to coat the chip. Filling the cavity with dissatisfaction will lead to ...
Editor’s note: This is a corollary to an article by the same author on instances when a hydraulic press might be the best option — “Hydraulic vs. Electric Injection Molding Machines: When Energy ...
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